DPAC Technologies (OTCBB: DPAC.OB) is a pioneer in developing embedded wireless device networking for machine-to-machine communication. Its primary, wholly-owned subsidiary, QuaTech, Inc. (www.quatech.com) is a leading manufacturer of device networking and connectivity solutions.
DPAC’s flagship Airborne™ and AirborneDirect™ line of embedded 802.11 radios, modules, boards and external wireless device servers continues as an integral part of Quatech’s device networking product line.
History
In February 2006, DPAC Technologies and Quatech, Inc. completed a merger to combine strengths and provide one of the industry’s most complete lines of device networking and connectivity solutions. DPAC Technologies is now based in Hudson, OH.
Founded in 1981 in Garden Grove, California, DPAC Technologies became the first company to develop and build 802.11 integration modules and connectivity products for machine-to-machine communication applications. DPAC's products and packaged subsystems are used by major OEMs in the transportation, homeland security, medical diagnostics and a wide variety of other markets to enable remote data collection and control.
The Airborne and AirborneDirect products offer OEMs a reliable solution for applications that require industrial-grade performance with a quick time-to-market. In addition to delivering 802.11 connectivity and interoperability in the only compact module designed to operate across the full industrial temperature spectrum, Airborne and AirborneDirect delivers advanced security and other important features like low power modes, a built-in web server and a 5-year warranty.
The Airborne and AirborneDirect Evaluation Kits are the starting point for OEM engineers, allowing them to experiment and quickly gain a full understanding of all our products' capabilities. Then, when it's time to integrate RF/wireless into their products, these engineers choose from our embedded 802.11 wireless modules or packaged wireless system products. All of these are designed for ease-of-integration, with full TCP/IP networking, WEP and WPA security (with LEAP optional) and 802.11 RF technology built-in. DPAC products are designed for long-term reliability, plus hardened to withstand the extreme temperatures and other harsh conditions inherent in transportation, medical, scientific, industrial and other non-consumer applications.
Our products and expertise help OEMs achieve proof-of-concept without time-consuming, expensive and risky design projects You can quickly create the wireless networking solutions you need without burdening your internal engineering resources, or diverting them from your core business.
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